According to the Korea Economic Daily, citing industry sources, Samsung may unveil its investment plans as early as June 29 at a meeting between South Korean President Lee Jae-myung and the heads of the country’s largest corporations.
The potential project comes at a time when global chipmakers are battling for leadership in the AI infrastructure segment. Today, the key element in this race is not only the chips themselves, but also packaging technologies. It is these technologies that enable increased data processing speeds and computational efficiency.
According to the publication, the new facility may focus on advanced packaging technologies used in the production of HBM (High Bandwidth Memory). Such chips are considered one of the main components of modern artificial intelligence systems and are used in servers that train large language models.
Samsung already supplies memory to the industry’s major players, including Nvidia, AMD, and Google. However, in the HBM segment, the company currently trails its main competitor—SK Hynix, which holds a leading position.
Against this backdrop, Samsung is actively increasing its investments in new memory technologies. If the project in Gwangju is approved, it could become one of the largest projects in one of the fastest-growing markets in the global semiconductor industry.
